Shenzhen Interface Technology Co.,Limited (hereinafter referred to as “Interface”) is a high-tech enterprise specializing in chip lead frame mold design and integrated electronic system solutions. We provide global clients with one-stop services that span from core technology R&D to full-system integration.
Our core team consists of experienced engineers and technical experts with over 10 years of experience in semiconductor development, embedded systems engineering, and production management. We have built a solid track record in fields such as consumer electronics, industrial control, IoT, and automotive systems.
Core Business Areas
1. Chip Lead Frame Mold Design
We specialize in the precision design and manufacturing of lead frame and packaging molds, delivering customized structural solutions that ensure efficient chip packaging and optimal thermal performance.
Leveraging advanced mold design software and automated processing equipment, we offer full-process control from 3D modeling and material selection to sample production—ensuring high precision, reliability, and superior thermal management.
Our mold solutions support a wide range of chip types, including SoCs, PMICs, and high-performance communication ICs, and are widely applied across industrial electronics, automotive electronics, and smart home sectors.
2. Integrated Electronic System Solutions
As a comprehensive solution provider, Interface delivers highly integrated, low-power, and intelligent systems—from component selection and hardware design to embedded software development.
We offer end-to-end solutions across the following domains:
• AI Edge Computing Systems
• IoT Communication Modules
• Intelligent Power Management Systems (PMS)
• Industrial Control & Automation
• Automotive Electronics & ADAS Systems
With our full-stack technical services, clients can accelerate product development from prototyping to mass production. Our robust processes in circuit design, modular packaging, system integration, and large-scale manufacturing ensure high performance, stability, and reliability.
Our Advantages
• Custom Lead Frame Mold Design – Compatible with various packaging types to enhance thermal performance and chip efficiency.
• Full-Stack System Solutions – Covering hardware, embedded software, and technical support.
• Strict Quality Control – End-to-end traceability and ISO9001-compliant management system.
• Responsive Technical Service – 24/7 technical support and full lifecycle maintenance.
Technical Highlights
• Mold Design for Chip Packaging – BGA, QFN, LGA, and other advanced packaging types
• Edge Computing & IoT Integration – Multi-protocol support (Wi-Fi, BLE, 5G) and sensor interfaces
• High-Performance Power Management – Low-power design with DVFS (Dynamic Voltage and Frequency Scaling)
• Embedded SDKs – Supporting fast development across a wide range of MCUs and SoCs
Our Mission
Driven by innovation and customer commitment, Interface empowers clients to stay ahead in emerging markets such as smart manufacturing, connected homes, and autonomous driving. Through our dual engines of lead frame mold design and integrated system solutions, we aim to be your long-term strategic partner in building an intelligent future.
