Interface offers a diverse portfolio of semiconductor lead frame molds, engineered to support a wide range of packaging types and application scenarios. Our offerings include:
• Packaging Types:
DIP (Dual In-line Package) lead frame molds, QFP (Quad Flat Package) molds, SOP (Small Outline Package) molds, QFN (Quad Flat No-lead Package) molds, and TO (Transistor Outline) molds.
• Manufacturing Processes:
Stamping molds, chemical etching molds, and injection molding molds.
• Material Options:
Copper lead frame molds, aluminum lead frame molds, and silver-plated lead frame molds.
• Application Flexibility:
General-purpose lead frame molds, high-power lead frame molds, miniature lead frame molds, and special-purpose lead frame molds.