Interface offers a comprehensive range of packaging molds for diode and transistor chips, designed to meet the needs of diverse packaging types, manufacturing processes, materials, and application scenarios. Our product portfolio includes:
• Various Packaging Types:
TO (Transistor Outline) series molds, SOT (Small Outline Transistor) series molds, DFN (Dual Flat No-lead) molds, and more.
• Key Design Features:
Single-cavity molds, multi-cavity molds, embedded thermal-dissipation molds, and ultra-thin molds.
• Multiple Manufacturing Processes:
Stamping molds, chemical etching molds, and injection molding molds.
• Material Options:
Copper lead frame molds, aluminum lead frame molds, and silver-plated lead frame molds.
• Application Scenarios:
Molds for rectifier diodes, Schottky diodes, high-frequency transistors, and power transistors.
• Specialized Use Cases:
Moisture-resistant packaging molds, high thermal conductivity molds, and miniature packaging molds.