Interface offers a wide range of IC lead frame mold products, engineered to meet diverse application scenarios. Our portfolio includes:
• Various Packaging Types:
Single-layer lead frame molds, multi-layer lead frame molds, high-power lead frame molds, and ultra-thin lead frame molds.
• Multiple Manufacturing Processes:
Stamping molds, chemical etching molds, and injection molding molds.
• Multiple Material Options:
Copper lead frame molds, aluminum lead frame molds, and silver-plated lead frame molds.
• Comprehensive Pin Count & Layout Options:
Fine-pitch pin molds, large-pin molds, and special layout molds.
• Application-Specific Designs:
Lead frame molds for LEDs, sensors, and RF ICs.