Interface offers a comprehensive selection of plastic encapsulation molds, designed to support various packaging types, cavity configurations, materials, and special application needs. Our product range includes:
• Packaging Types:
IC encapsulation molds, LED encapsulation molds, diode & transistor encapsulation molds, power device molds, and sensor encapsulation molds.
• Cavity Configurations:
Single-cavity molds, multi-cavity molds, and adjustable-cavity molds.
• Material Options:
Epoxy resin encapsulation molds, thermoplastic molding molds, and high-performance polymer encapsulation molds.
• Design Variants:
Single-gate encapsulation molds, dual-gate encapsulation molds, and embedded-type encapsulation molds.
• Specialized Applications:
Optical encapsulation molds, moisture-resistant molds, ultra-thin molds, and high thermal-dissipation molds.
• Production Requirements:
High-speed encapsulation molds and fully customized encapsulation solutions.